Are you looking for a unique opportunity to be a part of something great? Want to join a 20,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology, Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip's nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our ; we affectionately refer to it as the Aggregate System and it's won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over without a great team dedicated to empowering innovation. People like you.

Visit our page to see what exciting opportunities and company await!

Job Description:

Work with design teams to determine best Advanced Packaging technology for Microchip's

products.

Define flows for signal, power and thermal analysis for advanced packaging- includes working

with EDA vendors to determine best tools and flows for our designs.

Work closely with design and architecture teams to achieve best possible outcomes on power,

signal and thermals for given design.

This position requires someone comfortable with the many aspects of advanced packaging for

Microchip products, and who enjoys the challenge of leading integration driven innovations across

geographically disperse teams in pursuit of taking advantage of Advanced Packaging

Requirements/Qualifications:

Education

Must have 8.5+ years' experience in packaging with special emphasis on Advanced Packaging

Must have a Bachelors in Electrical Engineering, Mechanical Engineering, Materials Science or

Physics (Masters or PhD preferred)

Job requirements/Required Skills and requirements

• Experience with package routing and layout using Cadence APD or similar tools
• Well-developed knowledge of thermal and electrical simulations, ideally Ansys Workbench,Flotherm.
• Ability to run Signal Integrity and Power Integrity simulations
• Experience with Advanced Packaging concept and technologies
• Experience with Advanced Packaging reliability, modelling and testing
• Ideally has broad knowledge of 3D and heterogeneous assembly technology - HBM/CoWoS and others
• A thorough understanding of semiconductor physics and various semiconductor processes is a plus
• Ability to problem solve and work with Die team to iterate through the package design process
• Excellent written and verbal communication skills and ability to work as a team player in a fastpaced environment. Good presentation skills.
• Self-motivated, attention to detail, ability to prepare technical reports by collecting, analyzing, and summarizing information, as well as write technical specifications and procedures
• Excellent time management skills

Travel Time:

Physical Attributes:

Physical Requirements:

Microchip Technology Inc is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.

For more information on applicable equal employment regulations, please refer to the EEO is the Law Poster and the EEO is the Law Poster Supplement. Please also refer to the Pay Transparency Policy Statement.